Intel's EMIB packaging technology is superior to TSMC's CoWoS for AI chips, positioning Intel to capture market share from TSMC as customers seek alternatives to long lead times.
Too little corroboration in the last 3 days to call a trend (3 articles). Watching for it to gain traction. It's spreading across NVDA & GOOGL — a theme crossing asset classes.
"Intel's EMIB takes a leaner route, embedding tiny silicon bridges only where the chips actually connect. That makes it cheaper and potentially better suited to the increasingly large AI chip designs...EMIB-T, recently hit a 98% yield rate, matching CoWoS in that metric, and has already drawn interest from Google (GOOG) (GOOGL), Amazon (AMZN), and Nvidia (NVDA)."
"TSMC's CoWoS is sold out into 2027, with some customers waiting well over a year. That backlog is pushing buyers to look for alternate suppliers, and Intel is ready."
"EMIB-T, recently hit a 98% yield rate, matching CoWoS in that metric, and has already drawn interest from Google (GOOG) (GOOGL), Amazon (AMZN), and Nvidia (NVDA)."